Name: Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)
SKU: 52298951
Price: 4256.84 MXN
Availability: InStock
Author: Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao
ISBN: 9780081025321

portada Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)

Formato

Libro Físico

Editorial

Woodhead Publishing

Autor

Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao

Año

2019

Idioma

Inglés

N° páginas

434

Encuadernación

Tapa Blanda

ISBN13

9780081025321

N° edición

Categorías

Ingeniería electrónica

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)

Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao (Autor) · Woodhead Publishing · Tapa Blanda

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Reseña del libro "Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)"

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.