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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series) (en Inglés)
Radojcic Riko; Pecht Michael; Rao Gopal (Autor)
·
Crc Press
· Tapa Dura
Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series) (en Inglés) - Radojcic Riko; Pecht Michael; Rao Gopal
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Origen: Reino Unido
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Reseña del libro "Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series) (en Inglés)"
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
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