Name: Electronic Packaging Materials and Their Properties (en Inglés)
Price: 2876.81 MXN
Availability: InStock
Author: Pecht Michael Agarwal Rakish Mccluskey F. Patrick Dish
ISBN: 9780849396250

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portada Electronic Packaging Materials and Their Properties (en Inglés)

Formato

Libro Físico

Editorial

Crc Press

Autor

Pecht Michael Agarwal Rakish Mccluskey F. Patrick Dish

Idioma

Inglés

N° páginas

120

Encuadernación

Tapa Dura

ISBN13

9780849396250

N° edición

Electronic Packaging Materials and Their Properties (en Inglés)

Pecht Michael Agarwal Rakish Mccluskey F. Patrick Dish (Autor) · Crc Press · Tapa Dura

Libro Físico

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Origen: Reino Unido (Costos de importación incluídos en el precio)

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Reseña del libro "Electronic Packaging Materials and Their Properties (en Inglés)"

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.